Home > Newly Shipped PCB > RO4003C 2-Layer 16mil ENIG PCB for High-Frequency RF Applications

RO4003C 2-Layer 16mil High-Frequency PCB
PCB Material:Rogers RO4003C / 0.5mm finished thickness
MOQ:1PCS
Price:19.99-89 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-14 working days
Payment Method:T/T, Paypal
 

RO4003C 2-Layer 16mil ENIG PCB for High-Frequency RF Applications


1.Introduction

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles while meeting the same electrical performance specifications. These laminates provide tight control on dielectric constant (Dk) and low loss, and can be processed using standard epoxy/glass methods at a fraction of the cost of conventional microwave materials. Unlike PTFE-based substrates, no special through-hole treatments or handling procedures are required.


RO4003C materials are non-brominated and not UL 94 V-0 rated. The thermal coefficient of expansion (CTE) of RO4003C is similar to copper, ensuring excellent dimensional stability—critical for mixed dielectric multi-layer boards. The low Z-axis CTE provides reliable plated through-hole quality even under severe thermal shock conditions. With a Tg >280°C (536°F), RO4003C maintains stable expansion characteristics across all circuit processing temperatures.


2.Key Features

Dielectric Constant (Dk): 3.38 ±0.05 @ 10 GHz
Dissipation Factor: 0.0027 @ 10 GHz, 0.0021 @ 2.5 GHz
Thermal Coefficient of Dk: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/°K
CTE: X: 11 ppm/°C, Y: 14 ppm/°C, Z: 46 ppm/°C
Moisture Absorption: 0.06%
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Board Thickness: 0.5mm (16mil core)


3.Benefits

Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication costs
Designed for performance-sensitive, high-volume applications
Competitively priced


RO4003C PCB


4.PCB Construction Details

ParameterSpecificationNotes
Base MaterialRO4003C
Layer CountDouble sided
Board Dimensions38.8mm x 52.4mm1-PCS, +/-0.15mm tolerance
Min. Trace/Space5/5 mils
Min. Hole Size0.2mm
Blind/Buried ViasNo
Finished Thickness0.5mm
Finished Cu Weight1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishElectroless Nickel Immersion GoldENIG
Top SilkscreenBlack
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% testedPrior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 - 35 μm
Rogers 4003C Core - 0.406 mm (16mil)
Copper layer 2 - 35 μm


6.PCB Statistics:

Components: 6
Total Pads: 17
Thru Hole Pads: 11
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 9
Nets: 2


7.Typical Applications

Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites


8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support


 

Get a Quick Quote

Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for RO4003C 2-Layer 16mil High-Frequency PCB with ENIG Finish.

No file chosen

Max 10MB/file: .zip, .pdf, .jpg, .png, .txt (multiple)

Your information is safe. We'll respond within 24 hours.

Previous RO4350B 2-Layer 16.6mil ENEPIG PCB for High-Frequency RF Applications

Next RO3210 2-Layer 30mil ENIG PCB for High-Frequency Wireless and Automotive Applications